Product Description

1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.

2. Apply to BGA **9 and BGA **3 testing.

3. eMMC data could be read and written fastly.

4. With *0 pins and pin pictch 0.5mm.

5. eMMC size of this product is *1.5x*3mm, we also provide other sizes of

             *2x*6mm

             *4x*8mm

             *2x*8mm.

6. Apply to eMMC thickness of 0.8mm and 1.5mm.

7. Accurate positioning on flat bottom pad and solder of eMMC.

8. Life cycle is around *5,**0 times.

9. Support flat bottom and solder ball testing.
  
  
Only one frame guide for each fixture default, please tell us you wanted size. If need more, you should pay another $*0 for per standard size plate.

We provide all kinds of IC test socket , eMMC/eMCP socket , SOP socket , TSOP socket , BGA socket and reballing fixture etc .







We're the original manufacturer , we can provide the excellent quality and  competitive price , if you have any inquiry , please don't hesitate to contact us ! ! !